1.江苏大学机械工程学院,江苏 镇江 212013
2.南京工业大学能源科学与工程学院,江苏 南京 211816
3.伯明翰大学化学工程学院,英国 伯明翰 B15 2TT
雷嘉琦(2000—),男,硕士研究生,从事热能存储技术研究,E-mail:2222352015@stmail.ujs.edu.cn;
赵彦琦,博士、教授,从事热能存储技术研究,E-mail:hazhaoyq@126.com。
收稿:2025-12-24,
修回:2026-02-05,
纸质出版:2026-03-28
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雷嘉琦, 赵彦琦, 丁玉龙. 相变材料热整流的相关研究进展[J]. 储能科学与技术, 2026, 15(3): 1073-1086.
LEI Jiaqi, ZHAO Yanqi, DING Yulong. Recent advances in thermal rectification of phase change materials[J]. Energy Storage Science and Technology, 2026, 15(3): 1073-1086.
雷嘉琦, 赵彦琦, 丁玉龙. 相变材料热整流的相关研究进展[J]. 储能科学与技术, 2026, 15(3): 1073-1086. DOI: 10.19799/j.cnki.2095-4239.2025.1159.
LEI Jiaqi, ZHAO Yanqi, DING Yulong. Recent advances in thermal rectification of phase change materials[J]. Energy Storage Science and Technology, 2026, 15(3): 1073-1086. DOI: 10.19799/j.cnki.2095-4239.2025.1159.
近年来,随着电子器件与芯片、工业能源系统与建筑节能、特种超材料等领域对高效热管理技术的需求越来越多,有关热流的调控研究逐渐成为热科学与材料科学交叉研究的重要方向。其中基于相变材料的热整流效应受到了全世界各地研究者的广泛关注。本文系统回顾了相变材料在热整流领域的研究进展,首先从材料相态变化的不同介绍了固-固相变与固-液相变材料的最新研究进展,分析了不同热整流器的设计差异。随后,重点阐述了基于相变材料的各类热整流器件的构建与优化,包括异质结设计、界面工程及材料复合对其热整流性能的提升作用。最后,介绍了有关于热整流材料在电子器件芯片散热、能源系统与建筑节能热管理及新型超材料中的应用进展,说明了相变温度与区间的精确调控、热整流比的提升以及循环稳定性进一步提高等一系列关键问题与挑战,并展望了面向下一代智能热管理的未来研究趋势。结合现有研究成果,提出通过掺杂或复合高分子与高导热材料、界面强化与微纳封装以及非对称梯度结构设计等方法来优化相变温度区间且进一步提升热整流性能,为高性能的热整流材料设计提供指导。
In recent years
with the increasing demand for efficient thermal management technologies in fields such as electronic devices and chips
industrial energy systems
building energy conservation
and functional metamaterials
research on the regulation of heat flow has gradually become an important interdisciplinary direction in thermal science and materials science. Among these
the thermal rectification effect based on phase change materials has attracted widespread attention from researchers worldwide. This paper systematically reviews the research progress of phase change materials in the field of thermal rectification. First
it introduces the latest research advances in solid-solid and solid-liquid phase change materials based on different material phase transitions
and analyzes the design differences among various thermal rectifiers. Then
it focuses on the construction and optimization of various thermal rectification devices based on phase change materials
including the improvement of thermal rectification performance through heterojunction design
interface engineering
and material compounding. Finally
the paper reviews the progress in the application of thermal rectification materials in electronic device chip heat dissipation
energy system and building energy-saving thermal management
and novel metamaterials. It discusses a series of key issues and challenges
including precise control of phase transition temperature and range
improvement of the thermal rectification (TR) ratio
and further enhancement of cyclic stability. The paper also looks forward to future research trends in next-generation intelligent thermal management. Based on existing research results
the paper proposes methods such as doping or compositing polymers with high thermal conductivity materials
interface strengthening and micro/nano encapsulation
and asymmetric gradient structure design to optimize the phase transition temperature range and further improve thermal rectification performance
providing guidance for the design of high-performance thermal rectification materials.
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